Extreme Tech Challenge Semiconductors and AI Innovation Forum
Extreme Tech Challenge Semiconductors and AI Innovation Forum
Extreme Tech Challenge ('XTC') is the world’s largest platform for accelerating outstanding founders building tech innovations to improve the world, as inspired by the UN Sustainable Development Goals.
Join us as we gather the deep tech and climate community to share robust discussions on the future of Semiconductors and AI, enable network building, and catalyze partnerships and engagements among the guests.
We will also be announcing the 8 startup finalists of the Extreme Tech Challenge Semiconductors and AI Startup Cup.
Thank to our sponsoring Partners, ARM, Hon Hai Technology Group (“Foxconn”), CBRE and Foley & Lardner LLP for your generous support.
Why Attend?
Be Informed: featuring leading experts in rich discussions
Discover Innovation: Meet the XTC Startup Cup Top 8 Semifinalists. Witness groundbreaking solutions in Semiconductors & Ecosystem and AI & Data Infrastructure that are unlocking new possibilities for climate action.
Network with leaders in climate innovation: Connect with leading corporate leaders, VCs, startup founders, startup ecosystem builders, and public sector stakeholders in this space.
Program
[5:00 PM] Arrival
[5:00 – 5:30 PM] Welcome Reception
[5:30 – 5:35 PM] Opening Remarks (Victoria Slivkoff, Young Sohn, Bill Tai)
[5:35 - 5:55 PM] Fireside Chat with Young Sohn (Walden Catalyst, Samsung) | Innovation Opportunities and Challenges ahead of Sustainable AI moderated by David (Dede) Goldschmidt (Vice President & Managing Director, Head of Samsung Catalyst Fund)
[5:55 - 6:05 PM] Announcing the startup finalists of the Semiconductors and AI Startup Cup with remarks from sponsors including Will Abbey (EVP, Chief Commercial Officer, Arm) and Jerry Hsaio (CPO, Hon Hai Technology Group ('Foxconn')
[6:05 - 6:30 PM] Panel on AI Chips and Infrastructure moderated by Jonathan Charles (Investment Director, Samsung Catalyst Fund) with guests Fabrizio Del Maffeo (CEO, Axelera), Davor Capalija (Senior Fellow, Tenstorrent), and Santosh Raghavan (Power Architecture & Silicon Tech Engineer, Groq)
[6:30 – 6:55 PM] Panel on Interconnect and Packaging Technologies for Sustainable AI moderated by Francis Ho (Partner, Walden Catalyst Ventures) with guests Alan Liu (CEO & Co-Founder, Quintessent) and Syrus Ziai (VP of Engineering, Eliyan)
[6:55 - 7:00 PM] Closing remarks
[7:00 - 8:00 PM] Networking Reception
XTC’s event is organized and operated solely by XTC (not Yahoo Inc. nor any of its affiliates or brands, including TechCrunch).