Primemas Deep Tech Forum - Rise of SoC Chiplets
Thursday, April 4th 6:30pm-9:00pm
Redwood City, CA
Agenda:
6:30 pm- 7:15 pm: Arrival & Happy Hour (Dinner & Drinks)
7:15 pm- 8:15 pm: Opening Remarks & Deep Tech Panel
8:15pm- 9:00 pm: Q&A & Conclusion
9:00 pm- 10:00 pm: Extended Social Time (as desired)
Panel Discussion:
🚀 Breaking Boundaries: Rise of SoC Chiplets
"Slashing Costs & Time to Market"
With the explosive rise of AI and the slowing of Moore's Law, once again, there is a bright spotlight shining on the semiconductor industry. The current and future needs for cost-effective computing and power efficiency have grown tremendously. Enter Chiplet technology as an elegant solution to meet the demands of a diverse marketplace, from edge to desktop to data centers. While some of the big industry players are already engineering novel chiplet design, packaging, and interconnect technologies to reduce costs and time to market, these solutions are not widely available to new entrants. To level the playing field and unleash the potential innovation of the entire semiconductor marketplace, a new type of SoC Chiplet or Platform technology is needed.
Hosts:
Il (Will) Park, Ph.D.: Founder/CEO, Primemas
Il (Will) Park has over 25 years of leadership experience at major semiconductor companies, including SK Hynix, Samsung, and IBM. Before establishing Primemas, he worked as a VP of the DRAM solution division at SK Hynix, was responsible for the SoC architecture development organization at Samsung S.LSI and led Power8 CPU development at IBM. Will is an expert in designing high-performance server CPUs, mobile SoCs, and DRAM solutions. He received his Ph.D. from Purdue University.
Tarey Gettys: COO, Primemas
Following a successful military career, as a Surface Warfare and Navy SEAL Officer, Tarey has spent the last 15 years in various leadership, operating, and investing roles within large corporate, as well as early-stage venture-backed companies. He has an MBA from Stanford Graduate School of Business and holds a BSc. in Math from the United States Naval Academy.
Panelists:
T.N. Vijaykumar, Ph.D.: Professor of Electrical and Computer Engineering @ Purdue University, ISCA Hall of Fame
Dr. Vijaykumar is a professor at Purdue University's Elmore Family School of Electrical and Computer Engineering. His research interests include computer architecture, accelerators for machine learning, secure microarchitectures, and data center network interfaces and routers. Dr. Vijaykumar has a Ph.D. & M.S. in Computer Science, University of Wisconsin, and a B.E. (Hons) in Electrical and Electronics and a M.Sc. (Tech) in Computer Science from the Birla Institute of Technology and Science, Pilani, India.
Tejas Karkhanis, Ph.D.: Software Engineer @ Alphabet (Google)
Tejas was previously an IBM TJ Watson Scientist specializing in microprocessor design and cybersecurity and currently he is a SW Engineer on Google's Core Search Team. The foundational paper of his Ph.D. dissertation, A First-Order Superscalar Processor Model, is an ISCA@50 selection and cited by ISCA as a top 25 contribution of computer architecture. Tejas has a Ph.D., M.S. and B.S. in Computer Engineering, Electrical Engineering, and Computer Science from University of Wisconsin-Madison.
Paul Fahey, Ph.D.: VP Technology, SK hynix
Paul has deep technology and product experience, spanning multiple decades and has held various leadership roles in companies including SK hynix, Intel, JEDEC Solid State Technology Association, and IBM. At SK hynix, he has served as the VP of Technology in multiple departments, including Advanced Memory, Technical Marketing and FAE, and Technology Strategy. Paul has a Ph.D. in Electrical Engineering from Stanford University, a BA in Physics from Brandeis University, and an MS in Electrical Engineering from UC San Diego.
Primemas:
Primemas is a deep-tech, fabless semiconductor company. As chip experts, we have decades of experience building real products for companies like IBM, Samsung, SK hynix, Tesla, and Apple. Our R&D team of Engineers operates from Seoul, Korea, building a modular SoC Hub Chiplet that can serve as a platform (or central building block) to enable a multitude of different and diverse market participants to build customized integrated circuits.
The Primemas SoC "Hublet" (Falcon-1), removes the time and costs involved in bringing these specialized chips to market using the traditional monolithic process, by a factor of 10x. Rather than starting from scratch to build a very expensive and time-consuming product, with our connectable Hub Chiplet SoC, chipmakers can use our D2D interface, SDK, and scalability features to build out as needed. The Falcon-1's novel architecture can be applied to products spanning edge devices to data center solutions without requiring a change in silicon.